Modelagem e simulação da solidificação direcional vertical ascendente de ligas binárias: solução via método das linhas

Abstract

Method of Lines (MOL) was used to analyze the equations that describe the heat transfer process during solidification of binary alloys. The physical model consisted of simulating the solidification of these alloys based on experimental results available in the literature, obtained in a vertical upward directional solidification device. A computer code based on FORTRAN 90/95 programming language, using the subroutine library DIVPAG IMSL, was developed to numerically solve ordinary differential systems of equations. Thermal variables such as growth rate of liquidus isotherm (VL), thermal gradient (GL) and cooling rate (TR) were determined from the cooling curves for alloys of three different systems used in this study (Al-Sn, Al-Cu and Sn-Pb). Finally, comparisons of numerical results obtained in this study with literature values were performed, demonstrating the potential of the technique used in treating such problems.